KOKI

			Equipment & Supplies for Electronic Assembly Order Online or Call us at 1-800-361-6727 or (514) 482-2548		Updated Health Information on Solder and Adhesive Fumes

KOKI Menu:

Lead free - No-clean flux cored wire solders

Lead Free Solder Paste Solutions

Package on Package Solutions (PoP)

Rework Tacky Flux

Halogen Free Solder Paste

NEW! Chipbonders safe for transport

Video Library

Articles and Guilds

MSDS Information

Anti-Erosion Flux Cored Solder Wire

Newly developed flux systems that combine both high-softening point resins and heat-resistant activators successfully realize excellent solderability with minimal flux spattering.

S3X-56M and S03X7C-56M have proven to excellent permance not only with SnAg based lead free alloys, but also SnAgBiCu and SnZnBi.

If you answer “YES” to any of the following Lead free issues, you must try Koki's lead free solder wire:

Are you currently assembling Lead Free products?
Are you are going through twice as many (or more) soldering tips than before?
Have you found that tips are turning black?
Are you getting poor wetting when hand soldering?
Are you cleaning the sites more often due to flux splatter?
Are you using more flux when hand soldering?
Are you seeing lower solder joint strengths after rework?
Are you seeing an increase in spiking or flagging of the joints?
Would you like to solve these lead free issues?

Koki Solder Wire Features:

Maintains tip life stable

Reduces dramatically flux spatter

Flows like leaded solder (really!)

Less "Spiking"

Easily solder fine copper wire

Comparison of the performance of Koki solder wire to others.

You can buy online or request a free sample to see for yourself here.

Download PDF Files:

Product Alloy composition
(melting point) Application

S3X-56M Sn3Ag0.5Cu (217~218°C) General purposes

S03X7Ca-56M Sn0.3Ag0.7Cu0.03Co+a (217~227°C) High performance Anti-erosion solder wire

S03X7C-56M Sn0.3Ag0.7Cu0.03Co (217~227°C) General purposes
Anti-erosion of iron bit

Lead Free Solder Paste:

Koki offers range of high performance lead-free solder pastes with high purity non-oxidized solder powders.

Specially developed high temperature resistant no-clean flux systems ensure as high soldering quality as conventional lead containing solder pastes realizing excellent fine pitch and micro components printability, and powerful solderability even in air reflow.

Product Alloy composition
(melting point) Application

S3X48-M406-5 series
Sn3Ag0.5Cu (217~218°C)

- Optional selections -

Sn3.5Ag (221°C)
Sn3.5Ag0.7Cu (218°C)
Sn3.8Ag0.7Cu (217~218°C)
Sn3.5AgCu0.5Sb0.2 (217~218°C)
Anti-pillow defect

S3X58-M406-3 series General purposes

S3X58-M406 series General purposes
Low voiding

S3X58-M650-3 Pin testable - Low voiding

S3X58-N200E Crack-free flux residue

S3X70-M407-4 Super fine particle
(10 - 25 ¦Ìm)

S3X58-M406D Dispensing

SB6N58-A730-3 Sn3.5Ag0.5Bi6In
(202 ~211°C) Low melting point

TB48-M741 Sn42.0Bi58.0
(138 (eutectic)°C) Low melting point

Koki Tacky Flux - Available as 406 series flux

Package on Package Solutions (PoP):
Package on Package Application Details

Please contact us for further details on Koki's package on package products

Halogen Free Solder Pastes

Recent increasing consciousness about ecology on a global scale has started considerations for the restriction of certain elements within soldering materials used within the electronics industry.
Ever since it’s been reported that dioxins can be generated when specific kinds of halide are combusted, there have been moves afoot to eliminate halogens from soldering materials.
Koki’s research and development team have been working on this “halogen free” issue for many years, and offers true “halogen free” solder pastes.

Halogen Free
Substance	Permissible limit (by weight)
Bromine (Br)
Chlorine (Cl)
Total concentration of Cl + Br

Download PDF File：

Product type	Product	Alloy composition (melting point)	Application	Pdf
No-clean solder paste	S3X48-M410A	Sn3Ag0.5Cu (217 - 218 C)	General purpose	(1,130KB)
No-clean solder paste	S3X48-M650-3	Sn3Ag0.5Cu (217 - 218 C)	Low voiding ICT testable	(844KB)

Koki Chipbonders

Introducing Our New Chipbonders from KOKI: JU-45P and JU-110

All the characteristics of other chipbonder products.
SMT adhesive designed for dispensing or printing.
Ensures excellent high dot profile in dispensing.
Secures superior heat slump resistance in the curing process.
Safe for transport by air, truck or boat saving you money. DOES NOT CONTAIN substances restricted by Transport of Dangerous Goods (UN3077 & UN 3082) of environmental hazardous substances resulting in tremendous savings
Contact for further details.

Video Library

We have numerous other documents and videos in our library too large to download. Please contact us to recieve a free CD of these. Included in your CD will be some amazing videos of:

Video comparing thermally stable fluxes for lead free reflow.

-How voiding occurs.
-How pillowing occurs.
-How pin holes can occur with intrusive reflow
Click on the image to view. Size:2.3 MB

Type: *.WMV

Coming Soon

Voids being formed.
Pillow defect occuring.
BGA shorts being formed.
Tombstoning occuring.
Hot slumping occuring.
LGA's and QFN's defect simulations.
Dendrite growth simulation

Video comparing Koki lead free solder wire (S03X7C-56M) to other wires on the market.

Click on the image to view. Size: 2.78 MB

Type: *.WMV

Articles and Guilds

Solder Paste Handling Guildlines: Click here to open

We have numerous other documents and videos in our library. Please contact us to recieve a free CD of these.

MSDS Information:

406, 406-3 and 406L-3 Solder Paste

S3X-56M Solder Wire

Contact us for other details and MSDS information.for further information!

Read More>>
Koki Lead Free Solder Paste with Anti-Pillowing Features
Lead Free Solder Wire Maintains Tip Life and Improves Performance

Reflow Oven Solutions
Energy Savings
Operating Savings
Local Support
Read More>>

Zestron - High precision cleaning processes and services!
Read More>>

Need a Great Lead Free Soldering Station?
Questions on Lead Free Soldering?
Read More>>